Conzzeta shareholders decide in favor of share split and approve spin-off of the real estate business

Zurich, June 22, 2015. – At today’s Extraordinary General Meeting of Conzzeta AG, the shareholders voted in favor of all the proposals of the Board of Directors. The motions approved included the spin-off of the Real Estate business unit, which passed to the newly formed PLAZZA AG. The shareholders elected Markus Kellenberger as Chairman and Lauric Barbier, Martin Byland, Jacob Schmidheiny and Dominik Weber as members of the Board of Directors of PLAZZA AG. PLAZZA AG’s 'category A' registered shares will be listed on the SIX Swiss Exchange as of June 26.

In accordance with international financial regulations Conzzeta offers information on the spin-off of the Real Estate business unit in German only.


Increase of participation from 51% to 70%: Conzzeta acquires additional stake in DNE Laser

Zurich, August 27, 2019 – As part of the growth strategy in the Sheet Metal Processing segment, Conzzeta announces the signing of an equity transfer agreement to increase its participation in DNE Laser, Shenzhen, China, from 51% to 70%.


Half-Year Report at June 30, 2019: First half of 2019 with expected slowdown

  • Market-related slowdown compared with strong previous-year period
  • Net revenue CHF 770.1 million; on a comparable1 basis 5.6% below the previous year
  • EBIT CHF 90.5 million, including divestment gain of CHF 30.6 million
  • EBIT margin excluding divestment gain stable at 7.6% of total revenue
  • Earnings per share A including divestment gain at CHF 34.76, up 66.0%
  • Extraordinary AGM with proposal for a special dividend of CHF 30.00 per share A
  • More decentralized management for accelerated strategic and operational development 

FoamPartner: OBoSky® ‒ easy to process, durable and low in emissions

Wolfhausen, July 18, 2019 - FoamPartner, specializing in advanced foam solutions, has developed a foam product family characterized by extremely low emission levels for use in automotive headliners with high demands on processability and design.